Polycarbonate (PC) is one of the most versatile engineering thermoplastics in stampaggio a iniezione—transparent, impact-resistant, and thermally stable. But anyone who has actually run PC on a production line knows it is also one of the most finicky materials to process. Its high melt viscosity, extreme moisture sensitivity, and tendency to trap internal stress mean that even small process deviations can produce visible defects: discoloration, silver streaks, bubbles, flow marks, and stress cracking.
In this article, we walk through the six most common PC molding defects we encounter in production—discoloration and black spots, silver streaks and bubbles, flow marks, cold material spots, and internal stress cracking. For each defect, we explain the physical mechanism, how to diagnose it from the defect pattern, and the specific process and tooling adjustments that resolve it. These insights come from two decades of hands-on PC molding experience across automotive, medical, and consumer electronics applications.

- PC moisture sensitivity (requires <0.02% moisture) is the root cause of most surface defects
- Higher melt viscosity than ABS or PP means PC needs precise temperature and pressure control
- Internal stress in transparent PC parts can cause delayed cracking days after molding
- Most defects share common fixes: proper drying, optimized barrel temperature, and adequate mold venting
- Factory experience with 400+ materials shows that drying discipline alone eliminates 60% of PC defects
What Makes Polycarbonate Injection Molding So Challenging?
Polycarbonate is one of the most difficult engineering thermoplastics to injection mold. Its unique molecular structure—linear chains with benzene rings, isopropylidene groups, and carbonate linkages—creates three core processing challenges that set it apart from easier materials like polypropylene or ABS.
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First, PC has no sharp melting point. Instead, it gradually softens across a wide temperature range (230–320 °C), which means melt viscosity remains high1 throughout normal processing. Unlike semi-crystalline polymers that thin out dramatically above their melting point, PC behaves more like a Newtonian fluid—its viscosity is more sensitive to temperature changes than to shear rate. Small temperature deviations of just 10–15 °C can push the melt from processable to degraded.
Second, PC is extremely sensitive to moisture. Even trace amounts of water (above 0.02% by weight) cause hydrolytic degradation at processing temperatures, breaking polymer chains and reducing mechanical properties. This means thorough predrying at 120 °C for 3–4 hours is mandatory—not optional. In our experience processing over 400 materials at the Shanghai factory, moisture-related defects account for roughly 60% of all PC molding problems we troubleshoot.
In our Shanghai factory, with 20+ years of injection molding experience across 400+ plastic materials, we have seen every PC defect pattern imaginable. Moisture control and barrel temperature discipline are the two variables that separate a smooth PC production run from a costly scrap event.
Third, the high viscosity of PC melt means that stampo a iniezione design must accommodate higher injection pressures, larger gates and runners, and deeper exhaust grooves than what you would need for commodity plastics. Under-sized flow channels create excessive shear heat, which paradoxically causes thermal degradation even when barrel temperatures are set correctly. Understanding these three constraints—high viscosity, moisture sensitivity, and shear sensitivity—is the foundation for preventing every defect covered in this article.

What Causes Discoloration, Yellowing, and Black Spots in PC Parts?
Discoloration is the most common visual defect in PC injection molding, caused by thermal degradation of the melt. The root cause is typically excessive barrel temperature, overly long residence time, or dead zones in the plasticizing system where degraded material accumulates and intermittently releases into the melt stream.
Pure PC resin has excellent thermal stability and can tolerate temperatures up to 300 °C without significant decomposition. The problem arises when processors use modified PC blends, recycled material, or PC compounded with flame retardants and fillers. These additives narrow the processing window considerably. For example, PC/ABS blends typically require barrel temperatures around 250 °C, while PC/PBT blends for lighting products need approximately 280 °C—each combination has its own thermal ceiling that, once exceeded, triggers irreversible yellowing or carbonization.
Black spots are a particularly frustrating variant because they can appear intermittently—sometimes two or three shots in a row, then disappearing. This pattern almost always indicates dead material trapped somewhere in the plasticizing system: screw check ring gaps, nozzle tip interfaces, or barrel wall scoring. The trapped material carbonizes over time, then breaks loose in chunks. When PC decomposition products accumulate beyond a critical threshold, they also catalyze further decomposition, creating a cascading effect—especially severe in flame-retardant grades.
| PC Material Type | Recommended Barrel Temp | Degradation Risk Above |
|---|---|---|
| Pure PC (optical grade) | 270-300 C | 320 C |
| PC/ABS blend | 240-260 C | 280 C |
| PC with flame retardant | 230-260 C | 280 C |
| PC/PBT blend (lighting) | 260-280 C | 300 C |
| Recycled PC | 240-270 C | 290 C (variable) |
The fixes are systematic. First, verify barrel temperature setpoints against the material grade and reduce the feed and compression zone temperatures by 5–10 °C increments until discoloration stops. Second, ensure thorough drying: 120 °C for 3–4 hours using a dehumidifying dryer, never exceeding 10 hours to avoid material aging. Third, inspect the plasticizing system for dead zones—remove and clean the nozzle, check ring, and screw if air-shot melt shows discoloration even at correct temperatures. Finally, purge the barrel with a thermally stable material (PS or PE) before and after each production run, and never leave PC sitting at processing temperature during extended stops; drop the barrel to 160 °C (PC glass transition2) or below for thermal holds.
“Lowering barrel temperature is always the first step when PC parts show yellowing.”Vero
Lowering barrel temperature is the correct first response because excessive heat is the most common cause of PC yellowing. However, if discoloration persists after a 10-15 C reduction, the root cause likely shifts to dead material in the plasticizing system or contaminated raw material.
“Using higher back pressure always improves PC melt quality.”Falso
Excessive back pressure generates additional shear heat in the barrel, which can accelerate thermal degradation of PC. The correct approach is moderate back pressure (0.5-1.5 MPa) combined with adequate drying and proper barrel temperature profiling.

Why Do Silver Streaks and Bubbles Appear on PC Products?
Silver streaks (also called gas streaks) and bubbles are surface and internal defects caused by gas trapped in the melt during cavity filling. In PC injection molding, the four gas sources are water vapor, entrained air, thermal decomposition gas, and solvent gas—water vapor and decomposition gas account for the vast majority of cases.
Silver streaks form when gas dissolved in the pressurized melt escapes to the product surface as cavity pressure drops after filling. The escaping gas leaves tiny elongated bubbles that sparkle under light, always aligned with material flow direction. Bubbles, on the other hand, are gas pockets trapped in the wall thickness—particularly visible in transparent PC parts. Vacuum bubbles are different: they form not from gas but from volumetric shrinkage when insufficient holding pressure leaves a void in thick sections.
How to Diagnose the Gas Source Behind Silver Streaks
Diagnosing which gas is responsible requires reading the defect pattern. Randomly scattered surface bubbles point to water vapor—the most common culprit in PC because the material is so hygroscopic. Fine, dense bubble clusters concentrated near the gate in a radial or fan-shaped pattern indicate entrained air, typically from excessive screw retraction speed or insufficient back pressure. Discoloration accompanying the silver streaks points to decomposition gas from overheated melt. The diagnostic process matters because each gas source requires a different fix.
For moisture-driven silver streaks, the solution is straightforward: ensure drying at 120 °C for 3–4 hours with a dehumidifying dryer. Verify effectiveness by air-shooting—the extruded melt should be continuous, smooth, and free of white vapor. For air entrainment, reduce screw speed, increase back pressure, and extend melt time during the cooling phase. For decomposition gas, lower barrel temperature section by section starting from the nozzle, and check for excessively long residence times (using oversized equipment for small parts is a common culprit).
Vacuum bubbles require a different approach because they are a shrinkage phenomenon, not a gas issue. Increase holding pressure and extend holding time to pack more material into the thick section. Position the gate at the thickest wall to ensure pressure transmission. Increase mold temperature locally at the void location to slow solidification and allow shrinkage compensation. For transparent products, post-mold slow cooling in hot water can also reduce vacuum bubble formation.
“Post-molding heat treatment at 120 C for 2 hours can significantly reduce internal stress in PC parts.”Vero
Heat treatment at approximately 120 C allows PC molecular chain segments to regain mobility and relax frozen elastic deformation. Oriented molecules return toward a random state, reducing both orientation and temperature stress. This is standard practice for optical and stress-critical PC applications.
“Vacuum bubbles in PC parts are caused by trapped air.”Falso
Vacuum bubbles are actually caused by volumetric shrinkage during cooling, not trapped air. When holding pressure is insufficient or the gate freezes too early, the still-molten core shrinks away from the already-solidified skin, creating a void. The fix is increased holding pressure and time, not venting.
What Are Fingerprint Marks and Turbulence Lines—and How Do You Fix Them?
Fingerprint marks and turbulence lines are flow defects caused by PC melt viscosity being too high relative to injection speed and mold temperature. The melt fills the cavity in a stick-slip pattern, leaving wavy lines perpendicular to flow direction (fingerprints) or radial streaks near the gate (turbulence).
Fingerprint marks develop when injection speed and pressure are too low for the melt viscosity. The front of the melt stream contacts the cold mold wall, solidifies, and shrinks. The hot melt behind it pushes the shrunken skin forward, then that layer also cools and shrinks. This alternating advance-freeze cycle creates the characteristic wavy pattern that looks like a human fingerprint. The effect is most visible on large, flat PC surfaces—think display covers or control panels.
Turbulence marks are related but distinct. They appear as irregular flow lines radiating from the gate, caused by the melt hitting the cavity wall at high velocity and skidding across the cold surface before stabilizing into laminar flow. This defect is particularly common when gate design creates a sharp velocity transition—such as a small gate feeding into a large, thick cavity. The key distinction: fingerprints run perpendicular to flow, while turbulence lines run parallel.
Both defects share the same solution set. Increase the nozzle and front barrel temperatures to reduce melt viscosity—this is the single most effective adjustment. Raise mold temperature, especially at the location where marks appear; for appearance-critical PC parts, a mold temperature controller set to 100–120 °C is standard practice. Increase injection speed to shift the filling pattern from stick-slip to continuous flow; multi-stage injection allows you to adjust speed section by section, targeting the problem area without causing flash elsewhere. On the mold side, enlarge gates and runners to reduce flow resistance, and ensure adequate venting and cold-slug wells.
With 47 injection machines ranging from 90T to 1850T, and MOLDFLOW simulation for gate and runner optimization, we typically resolve flow mark issues during the DFM stage—before steel is ever cut. Simulation catches the velocity transitions that cause turbulence marks, allowing gate redesign before tooling.
How Do Cold Material Spots Form and How Can You Prevent Them?
Cold material spots are foggy, bright, or worm-shaped marks near the gate caused by partially solidified melt entering the cavity. They form when the melt front loses too much heat at the nozzle tip, runner, or gate before cavity filling begins—or when excessive holding pressure forces already-cooled runner material into the part.
There are two distinct mechanisms. The first is forward cold material: the melt at the nozzle tip and runner entrance cools between shots because the nozzle contacts the cold mold plate. When injection begins, this chilled material enters the cavity first. On thin-walled parts, it spreads into smoky or paste-like cloudy patches. On thick-walled parts, it forms a curved scar resembling an earthworm. The second mechanism is back-pressure cold material: excessive holding time and pressure squeeze already-cooled material from the runner and gate into the part, creating a small circular bright spot near the gate.
Prevention is straightforward but requires attention to detail. Install a cold-slug well at the end of each runner—this traps the forward cold material before it enters the cavity. Increase nozzle temperature to reduce heat loss at the tip. Increase mold temperature to narrow the gap between melt and mold surface temperatures. Reduce injection speed at the start of filling to avoid melt fracture at the gate, then increase speed for the main fill. Optimize gate position, size, and shape to avoid sharp velocity transitions. For holding-pressure cold spots, shorten holding time and reduce holding pressure to the minimum needed for dimensional stability. Also ensure thorough material drying—residual moisture in the cold-slug can worsen the visual defect.
Why Does Internal Stress Crack Transparent PC Products?
Internal stress in PC products is frozen-in molecular orientation and uneven cooling stress. It can cause warpage, reduced optical clarity, and delayed stress cracking days or weeks after molding—transparent PC parts are the canary in the coal mine.
Two primary mechanisms create internal stress. Orientation stress comes from polymer chains being stretched during flow and then frozen in place before they can relax back to a random coil configuration. Higher injection pressure, faster injection speed, and longer holding time all increase orientation by applying more shear to the melt. Temperature stress comes from the large temperature differential between the hot melt core and the cold mold wall. Because PC has high specific heat capacity and low thermal conductivity, the surface solidifies long before the interior—creating compressive stress on the outside and tensile stress on the inside.
The practical consequence is that a PC part may look perfect immediately after molding but develop micro-cracks within days, especially when exposed to organic solvents (cleaning agents, adhesives) or elevated temperatures. In our production environment, we have seen transparent PC lenses crack during assembly simply because the operator used an alcohol-based cleaning wipe—the internal stress was already at the failure threshold, and the solvent lowered it just enough to initiate cracking.
Our in-house mold manufacturing facility (100+ mold sets per month) allows us to optimize gate placement, runner geometry, and cooling channel layout specifically for stress-sensitive PC parts. Combined with ISO 9001 and ISO 13485 quality systems, we catch internal stress issues during first-article inspection using polarized light analysis.
“Polarized light analysis can detect internal stress in transparent PC parts before they crack.”Vero
Under polarized light, stressed PC exhibits birefringence patterns that reveal frozen molecular orientation and uneven cooling stress. This non-destructive inspection method allows factories to catch stress issues during first-article inspection, long before parts fail in service.
“Post-mold annealing at 120 C reduces internal stress in transparent PC parts.”Falso
Annealing at 120 C does indeed reduce internal stress by allowing molecular chains to relax. However, it is not a substitute for proper molding parameters—it can only reduce stress that was created, not eliminate it entirely. The most effective approach is to minimize stress during molding through correct temperature and pressure settings, then use annealing as a final quality assurance step for critical components.
Reducing internal stress requires a holistic approach. Increase melt temperature to reduce viscosity and orientation during flow. Increase mold temperature to allow slower, more uniform cooling and give oriented molecules time to relax. Reduce injection pressure to the minimum needed for complete filling. Minimize holding time—over-packing is a major contributor to orientation stress. Use variable-speed injection: fast fill to avoid flow defects, then slow speed for holding to reduce molecular alignment. For parts with metal inserts, preheat inserts to approximately 200 °C to reduce the thermal mismatch. Finally, post-mold heat treatment at 120 °C for approximately 2 hours allows chain segments to regain mobility and relax frozen deformation—this is standard practice for optical-grade PC components.
“Reducing injection pressure to the minimum needed for cavity filling helps prevent internal stress in PC parts.”Vero
Excessive injection pressure increases molecular orientation and shear stress, which increases internal stress and the risk of warpage and stress cracking. The minimum pressure that achieves complete filling, combined with adequate melt temperature, produces the lowest-stress PC parts.
“Increasing mold temperature above 100 °C always improves the surface finish of PC parts.”Falso
While higher mold temperature can reduce flow marks and improve surface gloss, exceeding 100 °C for extended cycles can cause excessively long cooling times and lead to thermal degradation of the PC resin near the gate. The optimal mold temperature range for PC is typically 80–100 °C, balancing finish quality with cycle efficiency and part stability.
What Processing Parameters Should You Monitor to Minimize PC Defects?
There are six parameters that matter most for PC defect prevention: drying, barrel temperature, injection speed, hold pressure, and mold temperature. Getting these right eliminates the vast majority of discoloration, silver streaks, bubbles, flow marks, and internal stress issues.
Drying is non-negotiable. PC requires moisture content below 0.02%3—achieved by dehumidifying dryer at 120 °C for 3–4 hours. Drying beyond 10 hours risks material degradation, especially for flame-retardant grades. Verify drying effectiveness by air-shot inspection before starting production. This single step prevents most silver streaks and surface bubbles.
Barrel temperature must be set as a profile, not a single number. For pure PC, a typical profile runs 250 °C (feed) → 270 °C (compression) → 285 °C (metering) → 290 °C (nozzle). Each modified grade has its own window—PC/ABS at roughly 20 °C lower, PC/PBT at similar or slightly higher temperatures. The key is to start at the lower end of the recommended range and increase only if flow marks or short shots appear. Never set all zones to the same temperature; a proper gradient ensures gradual plasticization without premature melting in the feed zone (which blocks air escape) or under-preheating (which traps air in the melt).
| Parametro | Recommended Range (Pure PC) | Defects Prevented |
|---|---|---|
| Drying temperature | 120 C, 3-4 h, dehumidified | Silver streaks, surface bubbles |
| Barrel temperature (nozzle) | 280-295 C | Short shots, flow marks |
| Temperatura dello stampo | 80-120 C | Fingerprint marks, internal stress |
| Velocità di iniezione | Multi-stage: fast fill, slow pack | Segni di turbolenza, sovracompressione |
| Pressione di mantenimento | 60-80% di pressione di iniezione | Bolle di vuoto, segni di affondamento |
| Tempo di mantenimento | Fino al congelamento del punto di iniezione (3-8 s) | Cavità da ritiro, deriva dimensionale |
Il tempo di permanenza del fuso merita un'attenzione particolare. Utilizzare attrezzature sovradimensionate per piccoli pezzi in PC è un errore comune—l'elevato rapporto peso colpo/capacità della canna significa che il materiale rimane alla temperatura di processo troppo a lungo, accumulando danni termici. Come regola generale, il peso della dose dovrebbe essere almeno del 30–40% della capacità della canna. Se devi produrre piccoli pezzi su macchine grandi, usa una vite di diametro inferiore o accetta che frequenti spurghi e cambi colore siano inevitabili. Infine, la temperatura dello stampo è più importante per il PC che per la maggior parte delle materie plastiche. Lavorare con stampi freddi (sotto gli 80 °C) accelera la solidificazione della pelle, aumenta lo stress interno e amplifica le striature di flusso. Per pezzi trasparenti o critici per l'aspetto, una temperatura dello stampo di 100–120 °C con un controllore di temperatura è lo standard del settore.

Quali Sono le Domande Più Comuni sui Difetti di Stampa a Iniezione in PC?
Domande frequenti
Qual è la temperatura ideale di essiccazione per il policarbonato prima della stampa a iniezione?
Il policarbonato deve essere essiccato a 120 °C utilizzando un essiccatore deumidificante per 3-4 ore per ottenere un contenuto di umidità inferiore allo 0.02% prima della stampa a iniezione. Questo è un requisito non negoziabile per una lavorazione di successo del PC—saltare o ridurre la fase di essiccazione è la causa più comune di difetti superficiali. L'essiccazione oltre le 10 ore rischia di degradare il materiale, soprattutto per le qualità ritardanti di fiamma che sono più sensibili al calore. Verificare sempre l'efficacia con un test di estrusione in aria prima dell'inizio della produzione—il fuso estruso deve essere continuo, liscio e privo di vapore bianco. Utilizzare un normale essiccatore tramoggia senza deumidificazione è insufficiente per il PC.
Cosa causa le macchie nere nei componenti stampati a iniezione in policarbonato?
Le macchie nere nei pezzi stampati a iniezione in PC sono tipicamente causate da materiale carbonizzato intrappolato nelle zone morte del sistema di plastificazione—come i giochi dell'anello di ritegno della vite, le interfacce della punta dell'ugello o i graffi sulla parete della canna. Il materiale intrappolato si degrada nel tempo e si stacca in modo intermittente nel flusso di fuso, producendo macchie scure che appaiono casualmente su diverse iniezioni per poi scomparire. Lo smontaggio e la pulizia regolari del sistema di plastificazione, combinati con una corretta procedura di spurgo della canna utilizzando PS o PE prima e dopo ogni ciclo di produzione, prevengono efficacemente questo problema. Non lasciare mai il materiale PC alla temperatura di processo durante fermate prolungate della macchina.
Qual è la temperatura di stampa a iniezione raccomandata per il policarbonato?
Per il policarbonato puro, il profilo di temperatura raccomandato per la canna è 250 °C (zona alimentazione) a 285-295 °C (ugello), con temperatura dello stampo a 80-120 °C. La chiave è utilizzare un gradiente di temperatura tra le zone piuttosto che un singolo setpoint, garantendo una plastificazione graduale senza fusione prematura nella zona di alimentazione. Le qualità modificate hanno finestre diverse: le miscele PC/ABS lavorano circa 20 °C più in basso, mentre le miscele PC/PBT potrebbero richiedere temperature simili o leggermente più alte. Iniziare sempre all'estremità inferiore dell'intervallo raccomandato e aumentare solo se compaiono difetti di flusso.
Come si previene lo stress interno nei prodotti trasparenti in PC?
Prevenire lo stress interno nei pezzi trasparenti in PC richiede un approccio a più fronti. Usare una temperatura di fuso più alta per ridurre la viscosità e l'orientamento molecolare durante il flusso. Aumentare la temperatura dello stampo a 100-120 °C per un raffreddamento più lento e uniforme che dia alle molecole orientate il tempo di rilassarsi. Minimizzare la pressione di iniezione e di mantenimento al minimo necessario per un riempimento completo. Usare un'iniezione a velocità variabile con riempimento rapido seguito da un'imballaggio lento. Il trattamento termico post-stampa a 120 °C per circa 2 ore è la pratica standard per i componenti ottici per rilassare l'orientamento molecolare congelato.
Perché compaiono striature argentate sui pezzi stampati a iniezione in PC?
Le striature argentate sui componenti in PC sono causate dal gas che sfugge sulla superficie del prodotto durante o dopo il riempimento della cavità, lasciando piccole bolle allungate che brillano sotto la luce. La fonte di gas più comune è il vapore acqueo proveniente da materiale non adeguatamente essiccato—questo rappresenta la maggior parte dei casi. Il gas da decomposizione termica dovuto a temperature eccessive della canna è la seconda causa più comune. Strie argentate fini e dense concentrate vicino al punto di iniezione in uno schema radiale indicano aria intrappolata dovuta a velocità della vite eccessiva o pressione di ritorno insufficiente. Un'essiccazione corretta a 120 °C per 3-4 ore elimina la maggior parte dei casi guidati dall'umidità.
È possibile correggere i difetti di stampa a iniezione in policarbonato regolando solo i parametri della macchina?
Molti difetti del PC—in particolare striature argentate, scolorimento e segni di flusso—possono essere risolti solo attraverso aggiustamenti dei parametri della macchina, principalmente condizioni di essiccazione, profilatura della temperatura della canna e ottimizzazione della velocità di iniezione. Tuttavia, difetti ricorrenti come macchie persistenti di materiale freddo o segni di turbolenza spesso richiedono modifiche allo stampo come punti di iniezione ingranditi, canali di sfiato aggiuntivi o pozzetti per colate fredde. La riduzione dello stress interno può anche richiedere cambiamenti progettuali per l'uniformità dello spessore della paretta e il preriscaldamento degli inserti. L'approccio più efficace combina l'ottimizzazione dei parametri con un corretto design dello stampo fin dall'inizio.
Qual è la differenza tra bolle e bolle da vuoto nei pezzi in PC?
Le bolle nei pezzi in PC sono cavità riempite di gas causate da vapore acqueo, aria inglobata o gas da decomposizione termica intrappolati durante il riempimento dello stampo. Sono presenti immediatamente all'apertura dello stampo e non crescono nel tempo. Le bolle da vuoto sono fondamentalmente diverse—sono cavità indotte da ritiro che si formano durante il raffreddamento quando la pressione di mantenimento è insufficiente a compensare il ritiro volumetrico nelle sezioni spesse. Le bolle da vuoto possono apparire o ingrandirsi dopo lo sformaggio man mano che l'interno continua a raffreddarsi e contrarsi. La differenza diagnostica determina se affrontare il contenuto di gas attraverso essiccazione e temperatura, o l'imballaggio attraverso la pressione di mantenimento.
Come Puoi Ottenere Supporto Esperto per il Tuo Progetto di Stampa a Iniezione in PC?
ZetarMold è il partner produttivo per progetti di stampaggio a iniezione in policarbonato che richiedono zero difetti. Il nostro team di ingegneria porta oltre 20 anni di esperienza nella lavorazione del PC e oltre 400 materiali in ogni progetto, dall'essiccazione del materiale e la profilatura della temperatura al design del punto di iniezione e la riduzione degli stress. La nostra struttura interna per gli stampi, la capacità di simulazione MOLDFLOW e i sistemi di qualità certificati ISO significano che i vostri componenti in PC sono progettati per la qualità fin dalla fase di DFM.
Hai bisogno di un preventivo per il tuo progetto di stampa a iniezione in policarbonato? Ottieni prezzi competitivi, feedback DFM e tempistiche di produzione dal nostro team di ingegneria. Richiedi un Preventivo Gratuito oggi stesso, o esplora la nostra Injection Molding Complete Guide per una panoramica completa del processo.
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melt viscosity remains high: la viscosità del fuso rimane alta si riferisce al fatto che la viscosità del fuso del PC è più sensibile alle variazioni di temperatura che alla velocità di taglio, comportandosi in modo simile a un fluido newtoniano durante la lavorazione. ↩
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PC glass transition: la transizione vetrosa del PC si riferisce al policarbonato che ha una temperatura di transizione vetrosa (Tg) di circa 147-150 °C, che determina la temperatura minima di mantenimento termico. ↩
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moisture content below 0.02%: il contenuto di umidità inferiore a 0,02% si riferisce a pC che richiede un contenuto di umidità inferiore a 0,02% (200 ppm) prima della lavorazione per prevenire la degradazione idrolitica alle temperature di stampaggio. ↩